The optical module market is facing strong growth: AI computing power and infrastructure upgrades drive demand, 800G→1.6T CPO technology breaks through the limit of energy efficiency, and local substitution and low-carbon policies co-shape a new pattern of high growth - supercomputing demand and intergenerational upgrades jointly lay the core growth logic.

Optical module heat dissipation dilemma: material reliability challenges under high heat flux density

High power density and heat flux density surged

The optical module rate has been upgraded from 400G to 800G/1.6T, and the power consumption of a single module has been rising, and the high heat flux density has led to the rapid accumulation of heat, which directly affects the stability and lifespan of the module.

Miniaturized packaging limits heat dissipation space

At present, high-speed optical modules are mostly used in compact packages such as QSFP", and the internal gap is extremely small, making it difficult for traditional heat dissipation solutions to fill the micro gaps. Under the integration of multiple heat sources, the thermal conductive material in the heat dissipation shell is poorly bonded to form local hot spots.

Long-term stability of thermal conductive materials

After long-term operation, the performance of the thermal conductive material deteriorates, and the volatilization and overflow of silicone oil in the thermal conductive material leads to the attenuation of optical signal scattering, which accelerates the overall performance of the module.
   Therefore, the long-term reliability of thermal conductive materials has become the core thermal management bottleneck restricting the evolution of optical modules to high density and high speed.

Traditional thermal interface materials encounter key performance bottlenecks

Thermal conductivity bottleneck
      Longitudinal thermal conductivity is severely insufficient: Traditional materials (gels/gaskets) cannot meet the high thermal flux density demands of evolving optical modules.
   Interfacial thermal resistance leads to failure: The roughness of the multi-stage heat dissipation interface leads to air gaps, and the interfacial thermal resistance accounts for more than 50%.

      Mechanical and reliability bottlenecks
    The dilemma between soft and hard materials is that the soft gel is easy to be extruded from the interface by thermal cycling, the high-hardness gasket is difficult to fit the curved surface, and the contradiction between compressibility and wear resistance is difficult to balance.

   Triple failure of long-term aging: optical path pollution, high-temperature siloxane volatile deposition lens (oil yield needs ≤1%); filler sedimentation, high-density filler (such as alumina) in soft matrix settling causes uneven thermal conductivity; The matrix is embrittle, and after 500 cycles of -40~150°C, the silica becomes brittle, and the compressibility plummets.

Optical module heat dissipation - HFC innovative solution

In response to the heat dissipation bottleneck of high-power density optical modules, HFC accurately matches the heat dissipation needs of optical modules and provides heat dissipation solutions.

HTG-S1200C gel: 400G-800G optical module thermal management is preferred

【Efficient thermal conductivity, precise temperature control】
       The high thermal conductivity of 12 W/m·K and the ultra-low thermal resistance of ≤0.04 °C·in²/W, combined with excellent wettability and low pressure thin layer formation (BLT) ability, significantly reduce the thermal resistance of the interface and ensure the temperature safety of key components such as lasers.

【Optical grade purity, stable escort】

It has extremely low volatility and low oil separation, effectively eliminating the volatilization of small molecules and the pollution of the optical path (lens, detector, etc.) by silicone oil precipitation, and ensuring the long-term accuracy and stability of the optical signal.

【Worry-free assembly, long-term and reliable】

The post-curing process supports convenient rework and solidifies to form a "soft gasket-like" structure. Provide ultra-low residual stress protection and excellent vibration resistance; high flow rate, anti-drip flow, anti-cracking design improves efficiency and yield; It has passed rigorous reliability tests (high temperature aging, high and low temperature impact, double 85) to verify the stability of thermal resistance and long-lasting performance.