HFC Achieves a Successful Start on the First Day of Heat Management Expo Europe!

In the era where computing power reigns, HFC leverages material innovation to solve thermal challenges, unlocking the potential of 2.5D packaging and providing sustained power for AI, HPC, and data centers.

Driven by multiple demands such as AI, 5G, and data center upgrades, the high-speed optical communication and switch market is experiencing rapid growth. Policies are promoting localization and low-carbon development, while emerging scenarios continue to expand boundaries. On the technology side, there is collaborative evolution towards high speed, intelligence, energy efficiency, and security, with innovations such as CPO, LPO, silicon photonics, and liquid cooling becoming key driving forces. The competition in network equipment computing power is intensifying, and the resulting surge in heat density has brought thermal management to the forefront. As the core of data centers, switch thermal management solutions have moved from behind-the-scenes support to a central focus, becoming one of the decisive factors determining product competitiveness and market structure.