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HFS-18C 20W
Features
  • The surface is soft and compressible
  • Low thermal resistance
  • Lightweight, high resilience
  • Applications at low pressures
  • Good thermal stability
  • Typical Applications
  • Satellites, radars and other military fields
  • Large servers
  • Data Processing Center
  • high-performance mobile phones, etc
  • 鸿富诚碳纤维导热垫片  HFS-18C 规格书
    HFS-18C Thermal Gap Filler.pdf
    产品参数
    ProjectTechnical indicatorsTesting standards
    ColorGray-blackVisual
    Specifications(mm)100*100ASTM D 5947
    Thickness(mm)0.5~2ASTM D 374
    Hardness(Shore 00)50(±10)ASTM D 2240
    Density(g/cc)2.0(±0.2)ASTM D 792

    Transient compressive stress(Psi)

    ≤120 (@50%)ASTM D 575

    Static compressive stress(Psi)

    ≤50 (@50%/10min) ASTM D 575
    Resilience(%)≥50ASTM D 575
    Oil seepage rate(%)<3HFC
    Operating temperature(℃)-40~125IEC 60068-2-14
    Thermal conductivity(W/m•K)  20
    ASTM D 5470
    Thermal resistance(°Cin²/W )≤0.2(@40psi/0.3mm)ASTM D 5470
    Pressure (Psi)10          20        30         40         50
    Thermal resistance(℃·in2/W)0.126    0.139    0.152    0.160    0.166
    Compression Ratio (%)17.25     45.03    58.13    65.53    70.83



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