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Compatible liquid metal thermal pad
Product Features
  • Low thermal resistance
  • No leakage
  • Good thermal stability
  • Good ductility
  • The corrosion on AI/CU is not significant
  • Typical application
  • Chip
  • Large server
  • Data Processing Center
  • HLM 03 Compatible Metal Thermal Pad.pdf
    HLM 03 Compatible Metal Thermal Pad.pdf
    产品参数
    Project Technical indicators Testing instrument Testing standards
    Color SilverVisual-
    Specifications(mm) -- Digital caliper ASTM D 5947
    Thickness(mm)0.1-0.5
    Digital caliper ASTM D 374
    Density(g/cc)7.2(±0.2) ZMD-2 Electron Density Meter ASTM D 792
    Melting point(℃)140(±10)Constant temperature electric heating plateGB/T 1425-2021
    Tensile strength(Mpa)≥3(@50psi)Compression TesterASTM D 575
    Compression ratio(%)≥20(@50psi)Compression TesterASTM D 575
    Vertical resistance(Ω) ≥10-3Megohmmeter ASTM D 257
    Surface resistance(Ω ≥10-3Megohmmeter ASTM D 257
    Thermal resistance(℃·cm2/W) ≤0.04(@50psi) LW-9389 Thermal Conductivity Tester ASTM D 5470
    Operating temperature (℃) -40~160 XB-OTS-150D-C Programmable Thermal Shock Chamber IEC 60068-2-14


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