HFC-phase change

FEATURES

Extremely low thermal resistance, efficient heat

dissipation.

Excellent heat transfer properties, and easy to

use.

Heat and pressure, the material will be further

thinned, thermal resistance will be lower.

excellent thermal stability, long-term use.

APPLICATIONS

Computer industry

IC market

Mobile phone industry

Network communication equipment

LED lighting

Automotive Electronics

Aerospace

HFC Phase Change HCM850 TDS

产品参数

Items	Parameter	Unit	Test Method
Color	Dark Grey深灰色	-	Visual
Thickness	0.2-0.5	mm	ASTM D 374
Density	2.8(±0.3)	g/cc	ASTM D 792
Phase Change Temperature	50（±5）	℃	DSC
Thermal conductivity	8.5(±0.5)	W/m·K	ASTM D 5470
Thermal resistance	≤0.045(@40psi/80℃)	℃in2/W	ASTM D 5470
Operating Temperature	-40~125	℃	IEC 60068-2-14