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Thermal cel
Product features:
  • 6.0(±0.5)W/m.K thermal conductivity
  • Does not cure. High reliability
  • Dispensing can be done by a variety of manual or automated processes
  • Soft, relieves assembly stress, shock absorption damping
  • Typical applications:
  • Semiconductor blocks and heat sinks
  • Used in LED luminaires and luminaires, automotive, and consumer sectors
  • Dispensed or directly applied in a variety of thicknesses and shapes
  • High-performance CPU and graphics processors
  • 鸿富诚导热凝胶HTG-600 规格书
    产品参数


    project Technical indicators Testing instruments Testing standards
    colorbuff Visual --
    density(g/cc) 3.5(±0.3) ZMD-2 electron density meter ASTM D 792
    Extrusion rate(g/min) ≥30(@90psi) Dispenser φ2.41mm EFDInjection head
    Fill gaps with minimal filling(mm) ≤0.15 Thermal conductivity tester--
    Volatile content(PPM) ≤200 oven GB269
    Instantaneous compressive stress(Psi) <10 Compressive stress tester GB/T 7757
    Static compressive stress(Psi) <1 Compressive stress testerGB/T 7757
    Flame retardant rating V-0 Flame retardant tester UL-94
    Operating temperature(℃) -40~200 XB-OTS-150D-C Programmable hot and cold shock box IEC 60068
    thermal conductivity(W/m·k) 6.0(±0.5) LW-9389 Thermal conductivity tester ASTM D 5470
    Thermal resistance(℃in2/W)(@20psi&1mm) ≤0.06(@60psi) LW-9389 Thermal conductivity tester ASTM D 5470
    击穿电压(KV/mm) ≥5 Withstand voltage tester ASTM D 149
    Volumetric resistivity(Ω·cm) ≥108 High resistance meter ASTM D 257
    Storage conditions and package rules

    Store refrigerated or in a dark place, storage temperature: ≤30°C, storage humidity: ≤70%
    Packing specification: 30cc/55cc/300cc


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