HFC-1200 Series

18926420354

FEATURES

Low thermal resistance

Being recognized as UL94 V-0

Viscous surface

Being able to work under low pressure

Excellent insulation performance and thermal resistance

APPLICATIONS

Between chip and heat-dissipation modules

Optoelectronic Industry

Netcom products

New energy battery and vehicles industry

Household appliances

Wearable equipments

HFC Thermal Silicone Pad H1200 TDS

产品参数

Tensile StrengthItems	Parameter	Unit	Test Standard
Color	Gray	-	Visual
Thickness	0.5~3	mm	ASTM D 374
Hardness	50（±10）	Shore C	ASTM D 2240
Density	3.5（±0.5）	g/cc	ASTM D 792
Tensile Strength	≥0.04	Mpa	ASTM D 412
Elongation	≥40	%	ASTM D 412
Compression Ratio	≥15(@30psi)	%	ASTM D 575
UL Certification	V-0	-	UL-94
Operating Temperature	-40~125	℃	IEC 60068
Thermal conductivity	12.0（±1.0）	W/m·k	ASTM D 5470
Thermal resistance	≤0.27(@10psi/2mm)	°Cin²/W	ASTM D 5470
Breakdown voltage	≥5	KV/mm	ASTM D 149
Volume resistivity	≥10¹⁰	Ω·cm	ASTM D 257
Dielectric constant	≥2	@1MHz	ASTM D 150
Dielectric loss	≤0.1	@1MHz	ASTM D 150